Efficient heat pump

ABSTRACT

An efficient heat pump is disclosed, the heat content of the refrigerant flowing out of an existing condenser is reduced by sub-cooling using an additional condenser. The heat reduced during the sub-cooling phase is added to the evaporator to superheat the refrigerant during evaporation phase. Removing heat from condensation phase (which is otherwise wasted) of the refrigeration cycle and adding that heat to the evaporation phase (which requires additional heat) may enhance the efficiency of the heat pump.

FIELD OF INVENTION

The present invention in general relates to heat pumps and in particular relates to enhancing performance of a heat pump.

BACKGROUND OF INVENTION

Typically, a cooling system such as refrigeration and air-conditioning systems include a heat pump to maintain the temperature (here degree of coldness) of the cooling system at a preset level. The heat pump absorbs the heat generated within the cooling system and dissipates the heat to an outside area (open space, for example). The heat pump includes a compressor, a condenser, an expansion valve and an evaporator. The heat pump uses the condenser to dissipate the heat of the refrigerant to the outside area. The heat dissipated to the outside area through the condenser may be advantageously used to heat matter such as liquids and gases. The heat content of the refrigerant entering the condenser from the compressor may be “X”° F. (for example, “X” may be around 180° F. to 220° F.). The condenser may dissipate heat from the refrigerant to the outside area or to the matter to reduce the heat content of the refrigerant and generally the refrigerant may lose Y° F. The heat content of the refrigerant at the outlet of the condenser (provided as input to the expansion valve) may be “X-Y”° F. (“X-Y” may be around 130° F. to 150° F.).

The low temperature (for example, 130° F. to 150° F.), high pressure vapor refrigerant is then passed through the expansion valve. As a result of the adiabatic expansion in the expansion valve, the temperature and pressure of the refrigerant decreases substantially. If the temperature of the refrigerant entering the expansion valve is higher (say X-Y=130 to 150° F.), after adiabatic expansion the temperature of the refrigerant may not drop to a level required to cause efficient refrigeration effect or cooling. On the other hand, the work load or the effort made by the expansion valve to bring the temperature of refrigerant to a desired level may be more if the temperature of the refrigerant entering the expansion valve is high. Also, the heat lost by the refrigerant is unnecessarily wasted. The higher work load on the expansion valve and the unnecessary wastage of heat may decrease the efficiency or performance of the heat pump. It is therefore desirable to reduce the temperature of the refrigerant entering the expansion valve.

BRIEF DISPRIPTION OF DRAWINGS

The invention herein described is by the way of example and not by the way of limiting by supplementing to the figures drawn. For clarity and simplicity of illusions, the elements in the figure are not necessarily drawn to the scale. For instance, dimension of some of the elements magnified when compared to other elements for clarity.

FIG. 1 illustrates a heat pump 100.

FIG. 2 illustrates a heat pump 200 including an air-cooled condenser in which the coefficient of performance is enhanced in accordance with a first embodiment.

FIG. 3 illustrates a heat pump 300 including a liquid cooled condenser in which the coefficient of performance is enhanced in accordance with a second embodiment.

FIG. 4 illustrates a heat pump 400 including a liquid cooled condenser, which enhances the efficiency of a liquid heating apparatus coupled to the heat pump 400 in accordance with one embodiment.

FIG. 5 illustrates the constructional details of sprinkler used in liquid cooled condenser in accordance with an embodiment.

FIG. 6 illustrates an arrangement 600, in which the liquid cooled sub-cooling apparatus is attached with the heat pump to enhance the efficiency in accordance with an embodiment.

FIG. 7 illustrates a heat pump 700 including an air-cooled condenser in which geothermal energy may be utilized to enhance the coefficient of performance in accordance to one embodiment.

FIG. 8 illustrates the constructional details of a condenser pipe in accordance with an embodiment.

FIG. 9 illustrates an arrangement 900 of an air-cooling system including a heat pump to enhance the efficiency of the air-cooling system in accordance with an embodiment.

FIG. 10 illustrates an arrangement 1000 of an air-heating system including a heat pump to enhance the efficiency of the air-heating system in accordance with an embodiment.

FIG. 11A, FIG. 11B, FIG. 11C and FIG. 11D illustrate the changes in phases of a refrigeration cycles by decreasing the temperature of refrigerant provided to the expansion valve and increasing the temperature of the refrigerant provided to the compressor in accordance with an embodiment.

FIG. 12 illustrate a table 1200 for change in temperature of air blown over second condenser 785 and change in temperature of liquid in liquid tank 725 with respect to time.

FIG. 13 depicts a graph 1300 plotted for change in temperature of air blown over second condenser 785 and change in temperature of liquid in liquid tank 725 with respect to time.

DETAILED DESCRIPTION

The following description describes an efficient heat pump liquid heater. In the following description, numerous specific details and choices are set forth in order to provide a more thorough understanding of the present invention. It will be appreciated, however, by one skilled in the art that the invention may be practiced without such specific details. In other instances, constructional details and other such details have not been shown in detail in order not to obscure the invention. Those of ordinary skill in the art, with the included descriptions, will be able to implement appropriate functionality without undue experimentation.

References in the specification to “one embodiment”, “an embodiment”, “an example embodiment”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that, it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Unless otherwise stated, the following terms used in the specification and claims have the meanings given below:

(1) “Liquid” used herein means, all types and grades of water, oil, fuels, gases, chemicals and mixtures thereof. In one embodiment, the liquid may be water, which may include hard water, soft water, salt water, distilled water, mineral water or any other such similar substance. (2) “Metal” used herein does not limit to a particular kind of metal. The metal may be of any kind, which may be used as a heat conducting metal. In one embodiment, the metal used for piping system may be made of copper, aluminum, alloys of copper, alloys of aluminum or any such other kind of alloyed metal, which may be a good conductor of heat.

In one embodiment, the refrigerant used in the heat pump may be any matter, which provides cooling effect. For example, the refrigerant may include carbon dioxide, ammonia, water, hydrofluorocarbons hydrochlorocarbons, hydrochlorodifluoromethane (R-22), chloropentafluoroethane (R-502), dichlorodifluorometane (R-12), trichlorofluoromethane (R-11), trichlorotrifluoroethane (R113), tetrafluoroethane (R-134a), dichlorotrifluoroethane (R123) and any other such similar refrigerant used in a refrigeration system.

In one embodiment, the efficiency of the heat pump may be enhanced by increasing the area of a conventional refrigeration cycle. In one embodiment, the efficiency of the heat pump may be enhanced by decreasing the temperature of the refrigerant (sub-cooling) flowing out of the condenser. In other embodiment, the efficiency of the heat pump may also be enhanced by increasing the temperature of the refrigerant (superheating) at the outlet of the evaporator. In one embodiment, the efficiency of the heat pump may be considerably enhanced by decreasing the temperature of the refrigerant (sub-cooling) flowing out of the condenser and increasing the temperature of the refrigerant (superheating) at the outlet of the evaporator. In one embodiment, sub-cooling may increase the length of the condensation phase and superheating may increase the length of the evaporation phase to cause an increase in the area of the refrigeration cycle. However, the compression phase and the expansion phase may remain unaffected due to superheating and sub-cooling (ideal cycle). In one embodiment, the efficiency or the coefficient of performance (COP) may equal the ratio of the length of condensation phase to the compression phase. The efficiency or the coefficient of performance (COP) may increase considerably as the length of the condensation phase (i.e., output) may be increased by sub-cooling, while maintaining the length of the compression phase (i.e., input).

In one embodiment, an additional condenser, which may be either air-cooled or liquid cooled may be coupled with the existing condenser to decrease (sub-cooling) the temperature of the refrigerant at the outlet of the existing condenser. In one embodiment, the outlet of the existing condenser may be coupled to the inlet of the additional condenser the refrigerant may be allowed to flow from the existing condenser to the additional condenser. In one embodiment, the air may be blown over the additional condenser, if the additional condenser is an air-cooled condenser. In one embodiment, the heat may be transferred from relatively hot refrigerant flowing through the additional condenser to the air blown over the additional condenser by conduction, or convection or radiation or any other such processes. In yet another approach, the additional condenser may be a liquid cooled condenser. In one embodiment, the additional condenser, which may be liquid cooled, is submerged into a liquid tank or liquid may be allowed to flow over the additional condenser or liquid may be sprinkled over the additional condenser. In one embodiment, the heat may be transferred from a relatively hot refrigerant flowing through the additional condenser to the liquid by conduction, or convection or radiation or any other such processes.

In one embodiment, the temperature of the refrigerant may be increased (superheating) at the outlet of the evaporator by adding additional heat to the refrigerant before providing the refrigerant to the compressor. In one embodiment, the heat contained in the refrigerant provided to the expansion valve may be used to superheat the refrigerant provided to the compressor by using a heat exchanger. In one embodiment, the heat exchanger may be tube-in-tube heat exchanger. In one embodiment, the heat may be transferred from the relatively hot refrigerant from the condenser to the relatively cold refrigerant from the evaporator flowing through the heat exchanger by conduction, or convection or radiation. In this approach heat from the relatively hot refrigerant may be effectively utilize to increase the temperature of relatively cold refrigerant.

In one embodiment, the advantages of using additional condenser and heat exchanger together in heat pump are as follows: (1) use to pre heat the liquid or gas or any such other substance; (2) use to superheat the refrigerant before providing to the compressor; (3) effective utilization of heat for various other purposes; (4) helps the compressor to work at lower head pressure; (5) saves power by using less wattage to compress per ton of refrigerant; and (6) enhances efficiency of heat pump substantially.

An arrangement 100 of a Heat Pump is illustrated in FIG. 1. The arrangement 100 may comprise a compressor 110, a condenser 120, an expansion valve 130, an evaporator 140 and an evaporator fan 145. The condenser 120 may be made of metal such as copper, aluminum, alloys of copper, alloys of aluminum or any other such metal, which may be good conductor of heat. The heat pump 100 may be couple to a power source 190. The power source 190 may a conventional power source or a non conventional power source.

The heat pump 100 may work on a reverse Carnot's cycle or a refrigeration cycle, which is depicted in FIG. 11A. The refrigeration cycle may comprise four phases/stages such as; compression (A-B), condensation (B-C), expansion (C-D) and evaporation (D-A). To start the operation of heat pump 100, the refrigerant may be injected into the heat pump 100 through a suction valve 133. Before injecting or providing the refrigerant to the heat pump 100, vacuum may be created inside the heat pump 100. The refrigerant injected into the heat pump may be at low pressure and low temperature. During the compression phase (A-B) the refrigerant may be compressed inside the compressor 110. As a result of compression, the refrigerant may attain high pressure and high temperature (superheating). The compression phase (A-B) illustrated in FIG. 11A represents an increase in pressure and temperature substantially, which is indicated as an increase in pressure and temperature from “A” to “B”.

The high pressure and the superheated refrigerant may be passed through the condenser 120. The condensation (B-C) may be performed to reduce the temperature of the refrigerant while maintaining the pressure of the refrigerant constant. The condenser 120 may be liquid cooled or air cooled. In The liquid cooled condenser may be submerged in the liquid tank. On other hand air from surrounding space may be blown over the air-cooled condenser. The high pressure and superheated refrigerant may be allowed to flow through the condenser 120. The high pressure, high temperature (superheated) refrigerant may undergo condensation inside the condenser 120 by which the temperature of the refrigerant may be reduced, while maintaining pressure constant. During condensation phase (B-C) the refrigerant may lose its latent heat to the surrounding space or liquid due to conduction, convection or radiation. The decrease in temperature of the refrigerant during the condensation phase may be depicted by a line between points “B” and “C” as illustrated in FIG. 11A.

The condensed high pressure, low temperature refrigerant may be passed through the expansion valve/device 130. The high pressure low temperature refrigerant may undergo adiabatic expansion indicated by the expansion phase (C-D). Due to adiabatic expansion, the pressure may drop substantially indicated by a line between the points “C” and “D” of FIG. 11A. As a result of adiabatic expansion the refrigerant flowing out of the expansion valve 130 may be in liquid form having low pressure and low temperature to provide refrigeration of cooling effect.

The evaporator 140 may convert the refrigerant in a liquid form to a gaseous form by increasing the temperature of the refrigerant as indicated by a line between “D” and “A” of FIG. 11A. It may be noted that the pressure of the refrigerant may remain unaffected during evaporation phase (D-A). The refrigerant in gaseous form but at a lower pressure may be provided to the compressor 110. To increase the temperature of the refrigerant in the evaporator 140, air may be blown over the evaporator 140 using the evaporator fan 145. In other approach, liquid may be allowed to flow over the evaporator 140 and latent heat may be added to the refrigerant during evaporation phase (D-A).

The temperature of the refrigerant flowing through the condenser 120 may be in the range of 200 to 220° F. and the temperature of the refrigerant flowing out of the condenser 120 may be in the range of 140 to 160° F. Generally, heat corresponding to a temperature of around 60° F. may be transferred to the liquid from the refrigerant flowing through the condenser 120. The cooling effect caused by the adiabatic expansion, in the expansion valve 130, may not be optimal if the temperature of the refrigerant entering the expansion valve 130 is between 140 and 160° F. The mass flow rate of refrigerant, which enters the compressor 110, may be more if the cooling effect obtained by the refrigerant due to adiabatic expansion is not optimal. As a result, more work has to be done by the compressor 110 to handle the mass flow rate of the refrigerant. In addition to the above disadvantages, the heat pump may work on high head and may draw more wattage of power from the power source. The above factors individually or together affect the efficiency of the heat pump 100.

In one embodiment, the efficiency of the heat pump 100 may be enhanced by effectively utilizing the heat content of the refrigerant to increase the area of the refrigeration cycle. An embodiment of an efficient heat pump in which an existing condenser is coupled to an additional air cooled condenser is illustrated in FIG. 2. In one embodiment, the efficiency of the heat pump 200 may be enhanced by increasing the condensation phase and evaporation phase, respectively, as depicted in FIG. 11B and FIG. 11C. In one embodiment, the length of the condensation phase may be increased from B-C to B-C_(new) by adding additional condenser along with the existing condenser. In other embodiment, the length of the evaporation phase may be increased from D-A to D-A_(new) by adding heat exchanger to transfer at least some quantity of heat from the refrigerant flowing into the expansion valve to the refrigerant flowing out of the evaporator. In one embodiment, the increase in the length of the condensation phase and the evaporation phase may be combined (as shown in FIG. 11D) to increase the overall area of the refrigeration cycle without affecting the length of compression (A-B) and expansion phase (C-D).

In one embodiment, the heat pump arrangement 200 may comprise a compressor 210, an existing condenser 220, an expansion valve/device 230, an evaporator 240, an evaporator fan 245, a heat exchanger 250, an additional condenser 285, a blower 281 and a liquid tank 225. In one embodiment, the air cooled condenser 285 may be coupled plurality to the condenser 220. In one embodiment, the inlet of the additional condenser 285 may be coupled to the outlet of the existing condenser 220. In one embodiment, the existing condenser 220 and additional condenser 285 may be made of metal such as copper, aluminum, alloys of copper, alloys of aluminum or any other such metals, which may be good conductor of heat. In one embodiment, the heat exchanger 250 may be tube-in-tube heat exchanger. In one embodiment, the heat pump 200 may further comprise of a temperature control user interface 280. In one embodiment, the heat pump 200 may be couple to a power source 290. In one embodiment, the power source 290 may a conventional power source or a non conventional power source.

In one embodiment, the liquid tank 225 comprises existing condenser 220. In one embodiment, the existing condenser 220 may be submerged into the liquid tank 225. In one embodiment, the high pressure and superheated refrigerant at a temperature of “X”° F. may be passed through the existing condenser 220. In one embodiment, the existing condenser 220 may be use to dissipate the heat from the refrigerant to the liquid in the tank 225. In one embodiment, the heat content of the refrigerant may be used to heat the liquid in the liquid tank 225. In one embodiment, the condensation (B-C) may be performed to reduce the temperature of the refrigerant while maintaining the pressure of the refrigerant constant. In one embodiment, during condensation phase (B-C) the refrigerant may lose its latent heat (=(X-Y)° F.) to the surrounding space or liquid due to conduction, convection, and/or radiation. The decrease in temperature of the refrigerant during the condensation phase may be depicted by a line between points “B” and “C” as illustrated in FIG. 11C.

In one embodiment, the condensed refrigerant at outlet of the existing condenser 220 (point “C” of FIG. 11B) may comprise a heat of “Y”° F. In one embodiment, the refrigeration effect provided by the refrigerant in evaporator 240 may be R1 if the refrigerant at “Y”° F. is made to pass through the expansion valve 230. Also, the mass flow rate of refrigerant to the compressor 210 (via evaporator 240) may be M1 if the refrigerant at “Y”° F. is made to pass through the expansion valve 230. In one embodiment, the refrigeration effect may increase from R1 to R2 and the mass flow rate of the refrigerant may decrease from M1 to M2 if the temperature of the refrigerant is decreased from “Y”° F. to “Y-K”° F.

For example, the refrigerant at the outlet of the compressor 210 may be at high pressure and high temperature. In one embodiment, the superheated refrigerant may enter the existing condenser 220 at a temperature of “220”° F. In one embodiment, the existing condenser 220 may be use to dissipate the heat from the refrigerant to the liquid in the tank 225. In one embodiment, the heat content of the refrigerant may be used to heat the liquid in the liquid tank 225. In one embodiment, the condensation (B-C) may be performed to reduce the temperature of the refrigerant while maintaining the pressure of the refrigerant constant. In one embodiment, during condensation phase (B-C) the refrigerant may lose its latent heat to the surrounding space or liquid due to conduction, convection, and/or radiation and the temperature may reduce to 140 to 160° F. In one embodiment, if the refrigerant may passed to the expansion valve 230 at the temperature of 140 to 160° F. the refrigeration effect may be low and the mass flow rate of the refrigerant may be more. In one embodiment, heat content of the refrigerant may be wasted at the inlet of the expansion valve 230.

In one embodiment, the temperature (heat content) “Y”° F. of the refrigerant flowing out of the existing condenser 220 on the path 213 may be utilized using the additional condenser 285 coupled to the existing condenser 220. In one embodiment, the inlet of the additional condenser 285 may be coupled to the outlet of the existing condenser 220. In one embodiment, the additional condenser 285 may reduce the heat content of the refrigerant from “Y” to “Y-K”° F. by blowing outside ambient air (i.e., sub-cooling) utilizing blower 281 over the additional condenser 285. In the process, the air (indicated by 282) that is blown over the additional condenser 285 may absorb the heat content from the refrigerant to further reduce the temperature of the refrigerant to “Y-K”° F. In one embodiment, the outside ambient air that has absorbed the heat of “Y-K”° F. from the refrigerant may be blown over the evaporator 240 as further described below. In one embodiment, by adding the additional condenser 285 the length of condensation phase (B-C) may be increased from BC to BC′ as depicted in FIG. 11C. In one embodiment, the sub-cooling phase (C-C′) of the refrigerant is illustrated in the FIG. 11C.

For example, the additional condenser 285 may reduce the temperature of the refrigerant at the outlet of the existing condenser 220. In one embodiment, the temperature of the refrigerant in the additional condenser 285 may be reduced from 140-160° F. to 90-110° F. In one embodiment, by passing the refrigerant to the expansion valve 230 at the temperature 90-110° F. may increase the refrigeration effect (R2) and the mass flow rate of the refrigerant may be decreased (M2). In one embodiment, the refrigerant flowing out of the additional condenser 285 may be passed through the heat exchanger 250 before providing the refrigerant to the expansion valve 230.

In one embodiment, the expansion valve 230 may receive the refrigerant flowing out of the additional condenser 285 at a temperature of “Y-K”° F. In one embodiment, the refrigerant may undergo adiabatic expansion depicted in by expansion phase (C′-D′) in FIG. 11C. In one embodiment, due to adiabatic expansion, the pressure may drop substantially indicated by a line between the points C′ and D′ of FIG. 11C. As a result of adiabatic expansion the refrigerant flowing out of the expansion valve 230 may be in liquid form having low pressure and low temperature to provide refrigeration or cooling effect of R2 (instead of R1). Also, the mass flow rate of the refrigerant flowing out of the expansion valve 230 to the evaporator 240 may decrease from M1 to M2.

In one embodiment, the evaporator 240 may receive refrigerant in liquid form having low pressure and low temperature (T1) flowing out of the expansion valve 230. In one embodiment, the liquid refrigerant providing refrigeration effect of R2 may undergo evaporation, which is depicted by evaporation phase (D′-A) in FIG. 11C. In one embodiment, due to evaporation, the temperature of the refrigerant may increase to T2 from T1 indicated by a line between the points D′ and A of FIG. 11C. As noted above, the air 282 that blown/passes over the additional condenser 285 may absorb heat content ((=Y-K)° F.) from the refrigerant passing through the additional condenser 285. In one embodiment, the air 282 that has absorbed heat content (hot air) from the refrigerant may be blown over the evaporator 240 to add latent heat and thus increase the rate of evaporation. In one embodiment, the effect of blowing the hot air on the evaporator 240 is depicted by D′ to D in FIG. 11C. In one embodiment, during evaporation phase (D′-A) temperature of the refrigerant may be increased from T1 to T2 by maintaining pressure constant.

In one embodiment, the heat exchanger 250 may be coupled to the outlet of the evaporator 240 and the refrigerant from the evaporator 240 may be allowed to flow through the heat exchanger 250 before providing the refrigerant to the compressor 210. In one embodiment, the heat exchanger 250 may receive refrigerant in vapor form having a temperature of T2 flowing out of the evaporator 240 and a refrigerant having a temperature of ((Y-K)° F.) flowing out of the additional condenser 285. In one embodiment, the temperature ((Y-K)° F.) of the refrigerant flowing out of the additional condenser 285 may be greater than the temperature T2 of the refrigerant flowing out of the evaporator 240. As a result, the heat may be transferred (by conduction, or convection, or radiation) from a relatively hot refrigerant (at ((Y-K)° F.)) flowing out of the additional condenser 285 to the relatively cold refrigerant (T2) flowing out of the evaporator 240. In one embodiment, the addition of heat to the refrigerant flowing out of the evaporator 240 in the heat exchanger 250 may be referred to as superheating and is depicted by line A to A′ in FIG. 11B. In one embodiment, due to superheating, the temperature of the refrigerant may increase to T3 from T2 indicated by a line between the points A-A′ of FIG. 11B. In one embodiment, the heat gained by the refrigerant in the heat exchanger 250 may equal (T3-T2). In one embodiment, the heat exchanger 250 may be tube-in-tube heat exchanger.

As a result of heat transfer from the refrigerant flowing through the heat exchanger 250 the heat content of the refrigerant may decrease from Y-K to Y-K-(T3-T2). For example, Y-K may be in the range of 90-110° F. and Y-K-(T3-T2) may be in the range of 70-90° F.

In one embodiment, the efficiency or coefficient of performance (COP) of the heat pump 100 may depend on the area of the refrigeration cycle A-B-C-D shown in FIG. 11A. The efficiency or COP of the conventional heat pump 100 is given by equation (1) below:

$\begin{matrix} \begin{matrix} {{{COP}({old})} = \frac{Output}{Input}} \\ {= {{COP}({old})}} \\ {= \frac{{length}\mspace{14mu} {of}\mspace{14mu} {condensation}}{{length}\mspace{14mu} {of}\mspace{14mu} {compression}}} \\ {= {{COP}({old})}} \\ {= \frac{BS}{AB}} \end{matrix} & (1) \end{matrix}$

In one embodiment, the efficiency or COP of the heat pump 200 may be enhanced by superheating and sub-cooling techniques described above. As a result of combining superheating and sub-cooling techniques in the heat pump 200, the area of the refrigeration cycle of the heat pump 200 may be equal to A′-B′-C′-D′ (which is greater than the area A-B-C-D) as depicted in FIG. 11D. The area of the refrigeration cycle may be increased by stretching the length of the condensation phase (B-C) and stretching the length of the evaporation phase (D-A). In one embodiment, the length of the condensation phase (sub-cooling) may be stretched by coupling additional condenser 285 with the existing condenser 220. In sub-cooling phase (C-C′) the temperature of the refrigerant may be reduced from C to C′ at the outlet of the condenser and before providing to the expansion device. In one embodiment, the length of the evaporation phase (superheating) may be stretched by connecting the heat exchanger at the outlet of the evaporator. In superheating phase (A-A′) the temperature of the refrigerant may be increase from A to A′ at the outlet of the evaporator and before providing to the compressor. In one embodiment, by combining both superheating and sub-cooling the efficiency of the heat pump may increase substantially. The combined and modified refrigeration cycle A′-B′-C′-D′ is depicted in FIG. 11D.

In one embodiment, by increasing the area of the refrigeration cycle to A′-B′-C′-D′ the efficiency of the heat pump 200 may be enhanced substantially. In one embodiment, the superheating and sub-cooling techniques may not affect the length of the compression phase (A-B) and the expansion phase (C-D). Therefore the length of the compression phase (A-B) and the expansion phase (C-D) may remain same (i.e., AB=A′B′ and CD=C′D′). Removing heat from condensation phase (which is otherwise wasted) of the refrigeration cycle and adding that heat to the evaporation phase (which requires additional heat) may enhance the efficiency of the heat pump. The new efficiency or COP of the heat pump may be given by equation (2) below:

$\begin{matrix} \begin{matrix} {{{COP}({new})} = \frac{Output}{Input}} \\ {= {{COP}({new})}} \\ {= \frac{{length}\mspace{14mu} {of}\mspace{14mu} {condensation}}{{length}\mspace{14mu} {of}\mspace{14mu} {compression}}} \\ {= {{COP}({new})}} \\ {= \frac{B^{\prime}S^{\prime}}{AB}} \end{matrix} & (2) \end{matrix}$

However, from equation (1) and equation (2), COP_((new)) may be greater than COP_((old)) as B′C′ is greater than BC.

Hence, from equation (2) above, it may be illustrated that the efficiency of the heat pump 200 may be enhanced substantially by adding additional condenser 285 at the outlet of the existing condenser 220 and increasing the temperature of the refrigerant by adding heat in the heat exchanger 250.

An embodiment of a heat pump 300 in which an existing condenser is coupled to an additional condenser to enhance the efficiency is illustrated in FIG. 3. In one embodiment, the efficiency of the heat pump 300 may be enhanced by increasing the condensation phase and evaporation phase, respectively, as depicted in FIG. 11B and FIG. 11C. In one embodiment, the heat pump 300 may comprise a compressor 301, an existing condenser 305, a heat exchanger 302, an expansion valve 303, an evaporator 304, an evaporator fan 308, a liquid heating tank 320, an additional condenser 340, a sprinkler 350 and a sub-cooling liquid tank 330. In one embodiment, the existing condenser 305 may be submerged into the liquid tank 330. In one embodiment, the heat pump 300 may be coupled to a power source 380. In one embodiment, power source 380 may be a conventional power source or a non conventional power source. In one embodiment, the temperature sensor 360 may be coupled to the control unit 385 to maintain the temperature of the liquid at a preset value. In one embodiment, the user may maintain the temperature of the liquid by configuring the pre-set value using a user interface 383. In one embodiment, the heat pump 300 may be similar to heat pump 200 described above with reference to FIG. 2. To maintain the brevity, only the differences between FIG. 2 and FIG. 3 are described below.

In one embodiment, the additional condenser 340 may be coupled to the existing condenser 305 and liquid such as water may be sprinkled over the additional condenser 340 using the sprinkler 350. In one embodiment, the temperature X-Y (heat content) of the refrigerant flowing out of the existing condenser 305 on the path 312 may be utilized using the additional condenser 340 to heat the liquid in the additional liquid tank 330. In the process, the liquid (indicated by 326) that is sprinkled over the additional condenser 340 may absorb the heat content of the refrigerant to further reduce the temperature of the refrigerant. By sprinkling liquid on the additional condenser 340, the temperature of the refrigerant may be decreased from (X-Y)° F. to (X-Y-K)° F. (i.e., sub-cooling described above) and the temperature decreased (K) in the process may be used to heat the liquid in the tank 330. In one embodiment, the refrigerant flowing out of the additional condenser 340 may be passed through the heat exchanger 302 to the expansion valve 303 and superheating of the refrigerant may happen as described above. As a result of sub-cooling and superheating, the area of the refrigeration cycle may increase and such an increase in the area of the refrigeration cycle may lead to enhancement of efficiency as described above (Illustrated in equation (2)).

In one embodiment, an outlet of the additional liquid tank 330 may be coupled to an inlet of the liquid tank 320. In one embodiment, the liquid heated (pre heated) in the tank 330 may then be passed to the liquid heating tank 320 to quickly heat the liquid in the tank 320 to a pre-set value.

An embodiment of an efficient heat pump 400 in which an existing condenser is coupled to an additional condenser is illustrated in FIG. 4. In one embodiment, the efficiency of the heat pump 400 may be enhanced by increasing the condensation phase and evaporation phase, respectively, as depicted in FIG. 11B and FIG. 11C. In one embodiment, the heat pump 400 may comprise a compressor 401, a heat exchanger 402, an expansion valve 403, an evaporator 404, a condenser 405, an evaporator fan 408, an additional condenser 440, a liquid heating tank 420, a sprinkler 450, a liquid pump 490, a liquid level control valve 455 and an additional liquid tank 430. In one embodiment, the heat pump arrangement 400 may be coupled to a power source 480. In one embodiment, the power source 480 may be a conventional power source or a non conventional power source. In one embodiment, user may set the required temperature by a user interface 483. In one embodiment, the heat pump 400 may be similar to heat pump 300 described above with reference to FIG. 3. To maintain the brevity, only the differences between FIG. 3 and FIG. 4 are described below.

In one embodiment, the additional condenser 440 may be coupled to the existing condenser 405 and liquid such as water may be sprinkled over the additional condenser 440 using the sprinkler 450. In one embodiment, the temperature X-Y (heat content) of the refrigerant flowing out of the existing condenser 405 on the path 412 may be utilized using the additional condenser 440 to heat the liquid in the additional liquid tank 430. In the process, the liquid (indicated by 426) that is sprinkled over the additional condenser 440 may absorb the heat content of the refrigerant to further reduce the temperature of the refrigerant. By sprinkling liquid on the additional condenser 440, the temperature of the refrigerant may be decreased from (X-Y)° F. to (X-Y-K)° F. (i.e., sub-cooling described above) and the temperature decreased (K) in the process may be used to heat the liquid in the tank 430. In one embodiment, the refrigerant flowing out of the additional condenser 440 may be passed through the heat exchanger 402 to the expansion valve 403. In one embodiment, the hot liquid stored in the tank 430 may be pumped using pump 490 to the evaporator 404 to facilitate superheating of the refrigerant. As a result of sub-cooling and superheating, the area of the refrigeration cycle may increase and such an increase in the area of the refrigeration cycle may lead to enhancement of efficiency as described above (Illustrated in equation (2)). Also, to conserve utilization of liquid, the liquid may be re-circulated (path 496) and sprinkled over the additional condenser 440.

In another embodiment, instead of using the sprinkler 450, the additional condenser 440 may be submerged into the additional liquid tank 430. In one embodiment, the additional liquid tank 430 may be provided with a level control valve 455 to control and maintain the liquid level inside the additional liquid tank 430. In other embodiment, the additional liquid tank 430 may be attached to the heat pump 400 to form a single unit as shown in FIG. 6.

In an embodiment, the constructional detail of the sprinkler 350 is illustrated in FIG. 5A. In one embodiment, the sprinkler 350 may be constructed using the pipe 510, which may be formed in any shape. In one embodiment, a multiple vents may be drilled in the pipe 510 such that the liquid flowing through the pipe 510 may be sprinkled over the additional condenser described above. In one embodiment, front view of the sprinkler 350 is shown in FIG. 5A.

In one embodiment, the bottom view of the sprinkler 350 is illustrated in FIG. 5B. In one embodiment, the vents 540-A to 540-N formed on the bottom surface of the pipe 510 may allow the liquid flowing through the pipe 510 to be sprayed. In one embodiment, the flow of liquid may be continues through the pipe 510 having tiny vents 540-A to 540-N may create pressure inside the pipe 510 that may result in spraying effect.

An embodiment of a heat pump 700 in which an existing condenser is coupled to an additional condenser to enhance the efficiency is illustrated in FIG. 7. In one embodiment, the efficiency of the heat pump 700 may be enhanced by increasing the condensation phase and evaporation phase, respectively, as depicted in FIG. 11B and FIG. 11C (which is also depicted in FIG. 11D (combined refrigeration cycle for sub-cooling and superheating)). In one embodiment, the heat pump arrangement 700 may comprise a compressor 710, an existing condenser 720, an expansion valve/device 730, an evaporator 740, an evaporator fan 745, a heat exchanger 750, an additional condenser 785, a blower 781 and a liquid tank 725. In one embodiment, the air cooled condenser 785 may be coupled plurality to the condenser 720. In one embodiment, the inlet of the additional condenser 785 may be coupled to the outlet of the existing condenser 720. In one embodiment, the existing condenser 720 and additional condenser 785 may be made of metal such as copper, aluminum, alloys of copper, alloys of aluminum or any other such metals, which may be good conductor of heat. In one embodiment, the heat exchanger 750 may be tube-in-tube heat exchanger. In one embodiment, the heat pump 700 may be coupled to a power source 780. In one embodiment, power source 790 may be a conventional power source or a non conventional power source. In one embodiment, the heat pump 700 may be similar to heat pump 200 described above with reference to FIG. 2. To maintain the brevity, only the differences between FIG. 2 and FIG. 7 are described below.

In one embodiment, the liquid supplied at an inlet of the liquid tank 725 may be at higher temperature (warm liquid), for example, due to utilization of geothermal energy. In one embodiment, the higher temperature or warm liquid may not allow maximum heat to be transferred from the superheated refrigerant passing through the existing condenser 720. As a result of lower than maximum heat transfer, the temperature of the refrigerant at the outlet of the existing condenser 720 may equal X-N° F. (wherein N<Y). In one embodiment, the refrigerant may carry heat (of Y-N° F.) to the additional condenser 785. In one embodiment, the refrigerant may lose “X-N-P”° F. (wherein P<K) in the additional condenser 785 after blowing ambient air 787 (at temperature L1° F.) over the additional condenser 785. In one embodiment, the refrigerant passing out of the additional condenser 785 at a temperature of X-N-P° F. may be provided as input to the expansion valve 730. In one embodiment, the refrigerant at the temperature of X-N-P° F. provided to the expansion valve 730 (instead of X-Y-K° F.) may cause lesser refrigeration effect at evaporator 740. Due to less refrigeration effect provided by the expansion valve 730, a higher mass flow rate M1 of refrigerant may occur. Due to less refrigeration effect and higher mass flow rate of refrigerant, the efficiency of the heat pump 700 may decrease considerably. In one embodiment, the warm liquid may be obtained by utilizing the geothermal energy or any such other source, which may be available very close to the surface of the ground (for example, at a depth of 7 to 10 feet) and the temperature of the environment may be below 0° F.

In one embodiment, the disadvantages of the above mentioned scenario may be overcome by placing the heat pump 700 in an environment (open space) that may be cooler than the enclosed space. In one embodiment, by placing the heat pump 700 at the outside environment, heat may be transferred effectively from refrigerant passing through the additional condenser 785 to the ambient air 787 blown over the additional condenser 785. In one embodiment, the temperature of the ambient air 787 may be equal to L2° F. (L2<L1) if the heat pump 700 is provisioned in an outside environment (i.e., substantially cooler than the ambient air 787 in the enclosed temperature). In one embodiment, the ambient air 787 at L2° F. may absorb more heat from the refrigerant passing through the additional condenser 785.

In one embodiment, the heat pump 700 may be placed over the roof top of a building or at any place such that the heat pump 700 may be substantially exposed to a cooler temperature of the outside environment. In one embodiment, the ambient air 787 (of temperature L2 depicted in column 1220 of FIG. 12) in the outside environment may be blown over the additional condenser 785 using the additional condenser fan 781. In one embodiment, the heat content of the refrigerant passing through the additional condenser 785 may be transferred effectively to ambient air 787. In one embodiment, the heat transfer from the refrigerant passing through the additional condenser 785 to the ambient air 787 blown over the additional condenser 785 may be equal to “X-Y-K”° F. In one embodiment, the change in temperature of the air after passing over the additional condenser 785 at regular intervals of time is, respectively, depicted in columns 1230 and 1210 of FIG. 12. In one embodiment, a change in temperature of the air of column 1230 plotted with reference to change in time of column 1210 is depicted in a graph 1310 of FIG. 13. In one embodiment, the gain in temperature of the air blown over the additional condenser 785 is depicted in column 1240 of FIG. 12.

It may be observed that as the time increases the temperature of air blown over the additional condenser 785 may increase as well. As the temperature of the air (depicted in column 1230) increases, the amount of heat absorbed from the refrigerant passing through the additional condenser 785 may increase as well resulting in an increase in the length (from BC to BC′) of the sub-cooling phase of FIG. 11.C. Increase in the length of the sub-cooling phase from BC to BC′ may enhance the coefficient of performance (COP) of the heat pump 700. Also, the temperature of the liquid in the liquid tank 725 may increase as well as depicted in a graph of 1350, however, such an increase may be gradual as compared to increase in the temperature of the air depicted in 1310. In one embodiment, the gradual increase in the heat may be attributed to reduced transfer of heat (X-N° F. as compared to X-Y° F., wherein Y is >N) from the refrigerant flowing through existing condenser 720.

In one embodiment, the air blown over the additional condenser 785, which may extract heat content of the refrigerant, may be blown over the evaporator 740 to superheat the refrigerant during the evaporation phase. As a result, the length of the superheating phase (DA to DA′) and the area of the refrigeration cycle may increase (depicted in FIG. 11D) and hence the efficiency of the heat pump 700 may also increase.

An embodiment of the constructional details of the additional condenser 340 (or 440) is illustrated in FIG. 8A and FIG. 8B. The top view of the additional condenser 340 (shown in FIG. 8A) illustrates a pipe 810 comprising an inlet 810 and an outlet 830. In one embodiment, the pipe 810 may be formed into a spiral (shown in front view of FIG. 8B), which may have an oval shape, or circular shape or any other such shapes. In one embodiment, the additional condenser 340 may contain one or more coils such as 840-A to 840-D to facilitate effective heat transfer from the refrigerant flowing through the additional condenser 340 and the liquid or the air, which may come in contact with the coils 840-A to 840-D of the additional condenser 340. In one embodiment, the pipe 810 may be made of copper, aluminum, copper alloys, aluminum alloys, steel or its alloys or any other such metal, which may be good conductor of heat.

An embodiment of an air-cooling system including a heat pump 900 is illustrated in FIG. 9. In one embodiment, the heat pump 900 may also be used in an air-cooling system. In one embodiment, the air-cooling system may used to maintain the temperature of a space such as residential and industrial buildings at a temperature lesser than the outside temperature. In one embodiment, heat pump 900 may comprise a compressor 910, an existing condenser 920, an additional condenser 925, an expansion valve 930, an evaporator 940, a heat exchanger 970, an evaporator fan 950 and a condenser fan 960. In one embodiment, the heat pump 900 may operate in a manner similar to the heat pump 200 described above in FIG. 2.

In one embodiment, the refrigeration effect obtained in the evaporator 940 may be used to maintain the temperature (to provide air-cooling effect) of the space into which the heat pump 900 may be attached. In one embodiment, to provide the air-cooling effect within the space, air from the outside environment may be sucked and blown over the evaporator 940 by the evaporator fan 950. However, the refrigerant, which may be provided to the evaporator 940 from the expansion valve 930 may be sub-cooled as described above in FIG. 2 to enhance the refrigeration effect. In one embodiment, the air blown over the evaporator 940 may absorb the coldness of the refrigerant flowing through the evaporator 940 and provide air-cooling effect with enhanced efficiency. In one embodiment, the cold air 980 may be channelized or passed through a duct to the space that may be maintained at lower temperature.

An embodiment of an air-heating system including a heat pump 1000 is illustrated in FIG. 10. In one embodiment, the heat pump 1000 may also be used in the air-heating system. In one embodiment, the air-heating system may used to maintain the temperature of a space such as residential and industrial buildings at a temperature higher than the outside temperature. In one embodiment, heat pump 1000 may comprise a compressor 1010, an existing condenser 1020, an additional condenser 1025, an expansion valve 1030, an evaporator 1040, a heat exchanger 1070, an evaporator fan 1050 and a condenser fan 1060. In one embodiment, the heat pump 1000 may operate in a manner similar to the heat pump 200 described above in FIG. 2.

In one embodiment, the heating effect obtained in the existing condenser 1020 and additional condenser 1025 may be used to maintain the temperature (to provide air-heating effect) of the space into which the heat pump 1000 may be attached. In one embodiment, to provide the air-heating effect within the space, air from the outside environment may be sucked and blown over the existing condenser 1020 and additional condenser 1025 by the condenser fan 1060. However, the refrigerant, which may be provided to the existing condenser 1020 and additional condenser 1025 may be sub-cooled as described above to enhance the refrigeration effect. In one embodiment, the air blown over the existing condenser 1020 and additional condenser 1025 may absorb the heat content of the refrigerant flowing through the existing condenser 1020 and additional condenser 1025 and provide air-heating effect with enhanced efficiency. In one embodiment, the hot air 1085 may be channelized or passed through a duct to the space that may be maintained at higher temperature.

In one embodiment, the heat exchanger 1070 may be placed in between the evaporator fan 1050 and evaporator 1040. In one embodiment, the heat content of the refrigerant flowing out of the additional condenser 1025 through the heat exchanger 1070 may be utilized to add latent heat to the refrigerant flowing through the evaporator 1040 during evaporation phase D′-A′ as depicted in FIG. 11D. In one embodiment, air may be blown over the heat exchanger 1070. In one embodiment, air may absorb heat content of the refrigerant flowing through the heat exchanger 1070. In one embodiment, the hot air passing over the heat exchanger may be then blown over the evaporator 940 to add latent heat to the refrigerant.

While the invention has been described with reference to a preferred embodiment, it will be understood by one of ordinary skill in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present invention. In addition many modifications may be made to adopt a particular situation or material to the teachings of the present invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all of the embodiments falling within the scope of the appended claims.

The examples demonstrated in the figures and the description above is set forth to help a reader to understand the invention and by no means limit the scope of the invention. Various features and advantages of the present invention are set forth in the following claims. 

1. A heat pump comprising: an existing condenser, wherein the existing condenser includes an inlet, an outlet and a condenser pipe, wherein the existing condenser is to generate a first refrigerant at first temperature by dissipating a first portion of heat from a refrigerant flowing through the condenser pipe to a medium surrounding the existing condenser, an additional condenser comprising an input side, an output side and a condenser element, wherein the input side is coupled to the outlet of the existing condenser and the output side is coupled to the first input of a heat exchanger, wherein the additional condenser is to generate a second refrigerant at a second temperature by further reducing a second portion of heat of the first refrigerant by dissipating the second portion of heat of the first refrigerant flowing through the condenser element to a substance flowing over the condenser element, a heat exchanger including a first and second input and a first and second output, wherein the heat exchanger is to receive the second refrigerant through the first input and a third refrigerant through the second input, wherein a third portion of heat content is transferred from the second refrigerant to the third refrigerant, an expansion valve is to generate a fourth refrigerant by performing adiabatic expansion in response to receiving the second refrigerant from the heat exchanger, and an evaporator to generate the third refrigerant in response to receiving the fourth refrigerant, wherein the heat content of the substance is added to the third refrigerant by passing the substance over the evaporator, wherein dissipating the second portion of heat of the first refrigerant flowing through the condenser element to a substance flowing over the condenser element and adding the heat content of the substance to the third refrigerant by passing the substance over the evaporator is to enhance the performance of the heat pump.
 2. The heat pump of claim 1, wherein reducing the second portion of heat of the first refrigerant by dissipating the second portion of heat of the first refrigerant flowing through the condenser element to a substance flowing over the condenser element is to increase an area of a refrigeration cycle by a first value.
 3. The heat pump of claim 1, wherein transferring the third portion of heat content from the second refrigerant to the third refrigerant is to increase the area of the refrigeration cycle by a second value.
 4. The heat pump of claim 1, wherein the condenser pipe of the existing condenser is made of a metal, which is a good conductor of heat.
 5. The heat pump of claim 1, wherein the condenser element of the additional condenser is made of metal, which is a good conductor of heat.
 6. The heat pump of claim 4, wherein the existing condenser is submerged in a first liquid tank to use the first portion of heat to increase the temperature of the liquid in the first liquid tank.
 7. The heat pump of claim 1 further comprises an air blower, wherein the air blower is to blow the air on the additional condenser to dissipate the second portion of heat from the first refrigerant.
 8. The heat pump of claim 1 further comprises a sprinkler, wherein the sprinkler is to sprinkle a liquid on the additional condenser to dissipate the second portion of heat from the first refrigerant.
 9. The heat pump of claim 1 further comprises a second liquid tank, wherein the additional condenser is submerged into the second liquid tank, wherein the second portion of heat is dissipated to the liquid in the second liquid tank from the first refrigerant.
 10. The heat pump of claim 1, wherein the second portion of heat extracted from the first refrigerant in the additional condenser is added to the third refrigerant to increase the temperature of the third refrigerant generated by the evaporator.
 11. The heat pump of claim 10, wherein the second portion of heat is absorbed by an ambient air blown over the additional condenser.
 12. The heat pump of claim 11, wherein the ambient air, which has absorbed the second portion of heat, is blown over the evaporator to increase the temperature of the third refrigerant.
 13. The heat pump of claim 1, wherein the heat pump is placed in an open space outside the enclosed space, wherein the temperature of the open space is substantially lesser than that of the enclosed space.
 14. The heat pump of claim 13, wherein ambient air from the open space that is cold is used to extract the second portion of heat from the first refrigerant while passing through the additional condenser during a second condensation phase.
 15. The heat pump of claim 14, wherein the extracted second portion of heat is utilized to increase the temperature of the third refrigerant during evaporation phase.
 16. The heat pump of claim 9, wherein the liquid in the second liquid tank is allowed to flow over the evaporator to add second portion of heat to the third refrigerant.
 17. The heat pump of claim 1, wherein the heat exchanger is used to further increase the temperature of the third refrigerant by allowing the third portion of heat of the second refrigerant to be transferred to the third refrigerant within the heat exchanger.
 18. The heat pump of claim 17, wherein the heat exchanger is tube-in-tube heat exchanger.
 19. The heat pump of claim 1, wherein the extracting the second portion of heat from the first refrigerant in the additional condenser is to enhance the refrigeration effect of the fourth refrigerant.
 20. The heat pump of claim 19, wherein the enhanced refrigeration effect of the fourth refrigerant is use to provide cooling effect by passing ambient air over the fourth refrigerant, wherein the ambient air that is passed over the fourth refrigerant is distributed in a closed industrial and domestic space.
 21. The heat pump of claim 17, wherein the first portion of the heat and the second portion of heat is channelized to provide heating effect in a closed industrial and domestic space.
 22. A method to enhance coefficient of performance of a heat pump, comprising: receiving an initial refrigerant, generating a first refrigerant at a first temperature by dissipating a first portion of heat from the initial refrigerant in a first condensation phase, generating a second refrigerant at a second temperature by further reducing a second portion of heat from the first refrigerant by dissipating the second portion of heat of the first refrigerant in a second condensation phase, transferring a third portion of heat from the second refrigerant to a third refrigerant in a superheating phase in response to receiving the second refrigerant and the third refrigerant in a superheating phase, generating a fourth refrigerant by performing adiabatic expansion in response to receiving the second refrigerant after the superheating phase, and generating the third refrigerant in response to receiving the fourth refrigerant, wherein the second portion of heat extracted in the second condensation phase is added to the third refrigerant in an evaporation phase, wherein dissipating the second portion of heat of the first refrigerant in second condensation phase and adding the second portion of heat to the third refrigerant in evaporation phase is to enhance the performance of the heat pump.
 23. The method of claim 22, wherein dissipating the second portion of heat of the first refrigerant in second condensation phase is to increase an area of a refrigeration cycle by a first value.
 24. The method of claim 22, wherein transferring the third portion of heat content from the second refrigerant to the third refrigerant is to increase the area of the refrigeration cycle by a second value.
 25. The method of claim 22 further comprises using a first liquid to extract the first portion of heat from the initial refrigerant, which increases the temperature of the first liquid.
 26. The method of claim 22 further comprises blowing ambient air to extract second portion of heat from the first refrigerant in the second condensation phase.
 27. The method of claim 22 further comprises sprinkling a second liquid to extract the second portion of heat from the first refrigerant in the second condensation phase.
 28. The method of claim 22 further comprises passing the first refrigerant through the second liquid to extract the second portion of heat from the first refrigerant in the second condensation phase.
 29. The method of claim 22 further comprises increasing the temperature of the third refrigerant generated in the evaporation phase by adding the second portion of heat extracted from the first refrigerant in the second condensation phase to the third refrigerant.
 30. The method of claim 26 further comprises increasing the temperature of the third refrigerant in the evaporation phase by blowing the ambient air, which has absorbed the second portion of heat from the first refrigerant.
 31. The method of claim 22 further comprises provisioning the heat pump in an open space outside the enclosed space, wherein the temperature of the open space is substantially lesser than that of the enclosed space.
 32. The method of claim 31 further comprises using the cold air from open space to extract the second portion of heat from the first refrigerant while passing through the additional condenser during a second condensation phase.
 33. The method of claim 33 further comprises increasing the temperature of the third refrigerant by utilizing the extracted second portion of heat during evaporation phase.
 34. The method of claim 28 further comprises adding the second portion of heat to the third refrigerant in the evaporation phase by allowing the second liquid to flow over third refrigerant.
 35. The method of claim 22 further comprises increasing the temperature of the third refrigerant by transferring the third portion of heat of the second refrigerant to the third refrigerant in the superheating phase.
 36. The method of claim 22 further comprises extracting the second portion of heat from the first refrigerant is to enhance the refrigeration effect of the fourth refrigerant.
 37. The method of claim 36, wherein using the enhanced refrigeration effect of the fourth refrigerant to provide cooling effect by passing ambient air over the fourth refrigerant, wherein the ambient air that is passed over the fourth refrigerant is distributed in a closed industrial and domestic space.
 38. The method of claim 22 further comprises channelizing the first portion of the heat and the second portion of heat to provide heating effect in a closed industrial and domestic space. 